Change modulation architecture (LFO/Envelope)

What is the problem?

Currently there are several Instrument parameters that can be assigned a LFO or an Envelope as a modulation source: Volume, Panning, Filter Cutoff, Wavetable Position, Granular Position and Finetune.

This means that at any one time you can have 6 LFOs or Envelopes (or combination) running simultaneously but the modulation sources are fixed to their associated parameter.

What should this feature achieve?

My suggestion is that the architecture could be flipped around so that you have 6 assignable modulation sources that can be either a LFO or an Envelope. These would be shown in the left-hand column on the Modulation page. Then in the next column you would select the destination (same parameters Volume, Pan etc.) for each of the modulation sources.

This would allow you to either assign a modulation source per Instrument parameter (Volume, Pan etc.) as it currently works but would also allow you, if you wanted to, to assign all 6 modulation sources to, say, Filter Cutoff so you could stack LFOs or stack an LFO with an Envelope etc.

I think this would make the Instrument modulation insanely more powerful and the processing overhead would not increase as you’d still only be processing the same simultaneous number of modulators (LFOs, Envelopes) per instrument.

Are there any workarounds?

Any links to related discussions?

Any references to other products?